SOLDERING FLUXES
for selective soldering

SelectIF 2040

SELECTIF 2040

NEW

  • Water based flux

  • For selective soldering

  • Absolutely halide-free

  • High deoxidation power

  • High temperature resistant

  • High compatibility with conformal coating

  • Low residue

Interflux® SelectIF 2040 is a water based no-clean selective soldering flux with a wide process window and low residue formation.

Interflux® SelectIF 2040 is a water based no-clean selective soldering flux with a wide process window and low residue formation.
Withstands high process temperatures and long process times.
For SnPb and lead-free processes
OR L0 according to EN and IPC standards
Solid content: 6,5% ±0,2
Halide content: 0,00%

IF 2005C

IF 2005C

  • Alcohol based

  • For selective soldering

  • For pre-tinning

  • Absolutely halide-free

  • High deoxidation power

  • Long preheat resistant

  • High compatibility with conformal coating

Interflux® IF 2005C with 3,3% of solids is a resin- and rosin-free, no-clean flux. It can be used when the soldering process needs more activation than IF 2005M or IF 2005K provide.

Interflux® IF 2005C with 3,3% of solids is a resin- and rosin-free, no-clean flux. It can be used when the soldering process needs more activation than IF 2005M or IF 2005K provide.
SnPb and lead-free compatible
Suitable for spray and foam fluxing
OR L0 according to EN and IPC standards
Solid content: 3,3% ± 0,3
Halide content: 0,00%

PACIFIC 2009M

PACIFIC 2009M

  • Water based flux

  • For wave soldering

  • For selective soldering

  • For pre-tinning

  • For spray fluxing

  • Absolutely halide-free

  • High compatibility with conformal coating

  • Low residue

Interflux® PacIFic 2009M is a water based no-clean flux mainly used for wave and selective soldering.

Interflux® PacIFic 2009M is a water based no-clean flux mainly used for wave and selective soldering.
For SnPb and lead-free processes
OR L0 according to EN and IPC standards
Solid content: 3,7% ±0,15
Halide content: 0,00%

PACIFIC 2009MLF

PACIFIC 2009MLF

  • Water based flux

  • For wave soldering

  • For selective soldering

  • For spray fluxing

  • Absolutely halide-free

  • Anti solder ball formation

PacIFic 2009MLF is a water based no-clean soldering flux developed to minimize micro solder ball formation.

PacIFic 2009MLF is a water based no-clean soldering flux developed to minimize micro solder ball formation.
For SnPb and lead-free processes
Main field of use: wave soldering and selective soldering
OR L0 according to EN and IPC standards
Solid content: 3,6% ±0,2
Halide content: 0,00%

IF 3006

IF 3006

  • Low VOC

  • For wave soldering

  • For selective soldering

  • For pre-tinning

  • Absolutely halide-free

  • High compatibility with conformal coating

Interflux® IF 3006 is a resin- and rosin free, no-clean soldering flux with a reduced VOC content.

Interflux® IF 3006 is a resin- and rosin free, no-clean soldering flux with a reduced VOC content.
For SnPb and lead-free processes
Also for pre-tinning
OR L0 according to EN and IPC standards
Solid content: 3,2% ±0,4
Halide content: 0,00%

AUXILIARIES
for selective soldering

IF 930 wettable nozzle cleanerIF 930 wettable nozzle cleaner

IF 930

nozzle cleaner

  • For selective soldering

  • For SnPb(Ag) processes

  • For lead-free processes

  • Absolutely halide-free

Interflux® IF 930cleans and de-oxidizes wettable nozzles of selective soldering systems.

Interflux® IF 930 cleans and de-oxidizes wettable nozzles of selective soldering systems.
Safe and easy one-step cleaning
Replaces IF 920

Anti-oxidant pellets

ANTI-OXIDANT PELLETS

  • For wave soldering

  • For selective soldering

  • For pre-tinning

  • For SnPb(Ag) processes

  • For lead-free processes

Interflux® Anti-oxidant pellets minimize the formation of oxides on lead-free and SnPb(Ag) solder baths.

Interflux® Anti-oxidant pellets minimize the formation of oxides on lead-free and SnPb(Ag) solder baths.
Used as an addition in the solder bath
For SnPb(Ag) (blue label) or lead-free (green label) alloys
Anti-oxidant pellets are not recommended under closed inert atmospheres
nor for Ni-doped solder alloys.

solder bars

SOLDER BARS

  • For wave soldering

  • For selective soldering

  • For pre-tinning

  • For dip soldering

Interflux® Solder Bars are made from high purity, low oxidation metals in SnPb(Ag) and lead-free alloys.

Interflux® Solder Bars are made from high purity, low oxidation metals in SnPb(Ag) and lead-free alloys.

Plain Solder Wire

PLAIN SOLDER WIRE

  • For selective soldering

  • For pre-tinning

  • For dip soldering

Interflux® plain solder wire for automatic solder feeding on selective soldering systems in lead-free and SnPb(Ag) alloys.

Interflux® plain solder wire for automatic solder feeding on selective soldering systems in lead-free and SnPb(Ag) alloys.
Wire diameter: 2mm/ 3mm
On 4kg/ 1kg spools
4kg spool size: 125mm x 125mm (dia.x length)

Solder Grenailles

SOLDER PELLETS

  • For wave soldering

  • For selective soldering

  • For rework & repair

  • For pre-tinning

  • For dipping

Interflux® Solder Pellets are small pieces of solder for easy solder bath filling in lead-free and SnPb(Ag) alloys.

Interflux® Solder Pellets are small pieces of solder for easy solder bath filling in lead-free and SnPb(Ag) alloys.

Size: 1cm x 1cm approx.

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CONTACT
INTERFLUX
HEADQUARTERS

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Gent zeehaven 3170A
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9042 Gent
BELGIUM

Tel.: +32 9251 4959
Fax: +32 9251 4970
info@interflux.com

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