NO-CLEAN
Solder Pastes

LMPA™-Q6 solder paste

LMPA™-Q6

NEW

  • Enhanced low melting point solder paste

  • High stability on the stencil

  • Absolutely halide-free

  • Smooth, clear and transparent residue

  • Low voiding

  • Reduced cost of production.

  • Increased mechanical reliability

Interflux® LMPA™-Q6 is a no-clean solder paste with the high reliability LMPA™-Q low melting point alloy.

Interflux® LMPA™-Q6 is a no-clean solder paste with the high reliability LMPA™-Q low melting point alloy.
LMPA™ -Q6 solder paste has improved printing stability, stencil life and more transparent residue compared to DP 5600.
RO L0 to IPC and EN standards.
Halide content 0,00%

DP 5600

DP 5600

POPULAR

  • For reflow soldering

  • For stencil printing

  • For dispensing

  • Absolutely halide-free

  • Low melting temperature

  • Low voiding

Interflux® DP 5600 is a no-clean solder paste for low temperature SnBi(Ag) alloys.

Interflux® DP 5600 is a no-clean solder paste for low temperature SnBi(Ag) alloys.
RO L0 to EN and IPC standards
Halide content: 0,00%
Sn42Bi57Ag1 (melting point 139°C ~ 282°F)

LP 5720 Pb-freeLP 5720 SnPb(Ag)

LP 5720

NEW

  • High stability on the stencil

  • Absolutely halide-free

  • For SnPb(Ag) alloys

  • For Lead-free alloys

  • Transparent post reflow residue

Interflux® LP 5720 is a no-clean solder paste with optimized printing stability and transparent residue after reflow, in lead-free and SnPb(Ag) alloys.

Interflux® LP 5720 is a no-clean solder paste with optimized printing stability and transparent residue after reflow, in lead-free and SnPb(Ag) alloys.
LP 5720 is the successor of DP 5505.
RO L0 to IPC and EN standards.
Halide content 0,00%

DP 5505 Pb-freeDP 5505 SnPb

DP 5505

  • For reflow soldering

  • For stencil printing

  • For dispensing

  • Absolutely halide-free

  • Lead-free alloys

  • SnPb alloys

Interflux® DP 5505 is our general purpose, high stability, no-clean solder paste in SnPb(Ag) and lead-free alloys.

Interflux® DP 5505 is our general purpose, high stability, no-clean solder paste in SnPb(Ag) and lead-free alloys.
Low voiding
High printing speeds
Suitable for Pin-in-Paste
Reduced head-in-pillow defect
RO L0 to EN and IPC standards
Halide content: 0,00%

µ-DIFE 7

  • For reflow soldering

  • For rework & repair

  • For dipping

  • Absolutely halide-free

Interflux® µ-dIFe 7 is a no-clean, lead-free solder paste for dipping applications.

Interflux® µ-dIFe 7 is a no-clean, lead-free solder paste for dipping applications.
Repeatable and selective paste volume
Fast and easy application
Reduced risk of bridging on μ-BGAs
Suitable for the ERSA Dip&Print Station
For Ball Grid Arrays, J-lead and Gull Wing ICs
RO L0 to EN and IPC standards
Halide content: 0,00%

IF 9009lt Pb-freeIF 9009lt SnPb

IF 9009LT

  • For reflow soldering

  • For stencil printing

  • For dispensing

  • Lead-free alloys

  • SnPb alloys

  • Increased activity

Interflux® IF 9009LT is a no-clean solder paste with increased activity in SnPb(Ag) and lead-free alloys.

Interflux® IF 9009LT is a no-clean solder paste with increased activity in SnPb(Ag) and lead-free alloys.
For degraded and difficult to solder surfaces
RE L1 to EN and IPC standards

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info@interflux.com

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