Products for dip soldering

Interflux^® IF 8300 is a no-clean, halide-free tacky gel flux suitable for reballing and BGA rework.

Interflux^® IF 2005C with 3,3% of solids is a resin- and rosin-free, no-clean soldering flux. It can be used when the soldering process needs more activation than IF 2005M or IF 2005K provide.
IF 2005C is preferred for selective soldering but can be used for wave and dip soldering too.

OR L0 according to EN and IPC standards

Interflux^® IF 910 de-oxidation oil separates oxides from good solder in a solder bath. It can drastically reduce the solder consumption.

Interflux^® plain solder wire for automatic solder feeding on selective soldering systems in lead-free and SnPb(Ag) alloys and in the LMPA-Q alloy. Standard diameters are 2mm and 3mm on a 4kg role.

Solder stones are convexly shaped pieces of LMPA-Q solder with dimensions of +/- d:37mm and H: 15mm for easy solder bath filling. The standard package is a 2,5kg plastic jar.

Solder rods are ø 5mm X +/- 320mm (+/- 52g) pieces of LMPA-Q solder alloy in a 15kg box.

Interflux^® Solder Bars are made from high purity, low oxidation metals in SnPb(Ag), lead-free and LMPA-Q alloys.

Interflux^® Solder Pellets are small pieces of solder for easy solder bath filling in lead-free and SnPb(Ag) alloys.