Sarma de lipit
FARA Pb

QF 70 Pb-free

QF 70

NEW

  • Increased wetting speed

  • Transparent residue

  • Absolutely halide-free

Interflux® QF 70 is an absolutely halide-free, rosin based no-clean solder wire with fast wetting for fast soldering operations in lead-free alloys.

Interflux® QF 70 is an absolutely halide-free, rosin based no-clean solder wire with fast wetting for fast soldering operations in lead-free alloys.
QF 70 can be used in both hand soldering and auto-mated soldering processes
RO L0 to IPC and EN standards.
Halide content 0,00%

1408
NH1 lead-free solder wire

NH 1

NEW

  • Increased wetting ability, increased wetting speed

  • Low spattering

  • Colophony free

  • Low transparent residue

  • High repeatability

  • Perfect for laser soldering

Interflux® NH 1 is a no-clean colophony free activated solder wire that gives fast and repeatable soldering results on a wide range of surfaces including brass, in lead-free alloys.

Interflux® NH 1 is a no-clean colophony free activated solder wire that gives fast and repeatable soldering results on a wide range of surfaces including brass, in lead-free alloys.
NH 1 can be used in both hand soldering and auto-mated soldering processes
RE L1 to IPC and EN standards.

1396
RosIX 705

RosIX 705

NEW

  • Increased wetting ability

  • Non disturbing smell

  • High repeatability

  • Smooth transparent residue

  • Perfect for laser soldering

Interflux® RosIX 705 is an activated rosin based, no-clean solder wire with increased wetting ability on surfaces that are difficult to solder in lead-free alloys.

Interflux® RosIX 705 is an activated rosin based, no-clean solder wire with increased wetting ability on surfaces that are difficult to solder in lead-free alloys.
RosIX 705 can be used on surfaces that are difficult
to solder, e.g. OSP, Ni, Zn, brass, German silver, etc.. as well
as on degraded and oxidized surfaces.
RO L1 to IPC and EN standards.

1432
Aquasol 4018

AQUASOL 4018

  • Water soluble solder wire

  • Lead-free solder wire

  • For rework & repair

  • Absolutely colophony free

  • High activity

Interflux® Aquasol 4018 is a high activity solder wire with water soluble residues in lead-free alloys.

Interflux® Aquasol 4018 is a high activity solder wire with water soluble residues in lead-free alloys.
Very good wetting ability on surfaces with poor solderabilty
Residues must be cleaned
Residues can be cleaned with DI water at 35°C-45°C (95°F— 114°F)
OR H1 to EN and IPC standards
Flux content: 2.5%

860
Interflux IF14 series lead-free solder wire

IF 14 SERIES LEAD-FREE

  • Sirma de lipire fara Pb

  • Pentru rework si reparatii

  • Reziduuri aplicabil cu bidineaua

  • Fara halogenuri

  • Fara colofoniu

  • Reziduuri reduse

Interflux® IF 14 serie sunt sarme de lipire fara colofoniu, fara halogenuri cu reziduuri usor de idepartat in aliaje SnPb(Ag) si fara Pb.

Interflux® IF 14 serie sunt sarme de lipire fara colofoniu, fara halogenuri cu reziduuri usor de idepartat in aliaje SnPb(Ag) si fara Pb.
Reziduuri indepartabile manual
Standarde RE LO conform EN si IPC
Fara Pb: IF 14-16 si IF 14-22 (1,6% si 2,2% continut de flux)
SnPb(Ag) : 0,6%, 0,9%,1,0% si 1,4% continut de flux

754
Interflux Flexsol 903 solder wire

FLEXSOL 903

  • Sirma de lipire fara Pb

  • Pentru rework si reparatii

  • Cu colofoniu

  • Fara halogenuri

  • Imprastiere redusa

Interflux® Flexsol 903 este o sirma de lipire fara Pb cu colofoniu, fara halogenuri.

Interflux® Flexsol 903 este o sirma de lipire fara Pb cu colofoniu, fara halogenuri.
Standarde RO LO conform EN si IPC
Continut de flux: 2,2% si 3,5%

756

Sarma de lipit
CuPb

RosIX 705 SnPb(Ag)

RosIX 705 SnPb(Ag)

NEW

  • Increased wetting ability

  • Non disturbing smell

  • High repeatability

  • Smooth transparent residue

  • Suitable for robot soldering

Interflux® RosIX 705 SnPb(Ag) is an activated rosin based, no-clean solder wire with increased wetting ability on surfaces that are difficult to solder in SnPb(Ag) alloys.

Interflux® RosIX 705 SnPb(Ag) is an activated rosin based, no-clean solder wire with increased wetting ability on surfaces that are difficult to solder in SnPb(Ag) alloys.
RosIX 705 SnPb(Ag) can be used on surfaces that are difficult to solder, e.g. OSP, Ni, Zn, brass, German silver,... as well as on degraded and oxidized surfaces.
RO L1 to IPC and EN standards.

1420
Interflux IF14 series leaded solder wire

IF14 SERIES SnPb(Ag)

  • Sarma de lipire SnPb(Ag)

  • Pentru rework si reparatii

  • Reziduuri aplicabil cu bidineaua

  • Fara halogenuri

  • Fara colofoniu

  • Reziduuri reduse

Interflux® IF 14 serie sunt sirme de lipire fara colofoniu, fara halogenuri cu reziduuri usor de indepartat in aliaje SnPb(Ag) si fara Pb.

Interflux® IF 14 serie sunt sirme de lipire fara colofoniu, fara halogenuri cu reziduuri usor de indepartat in aliaje SnPb(Ag) si fara Pb.
Reziduuri indepartabile manual
Standarde RE LO conform EN si IPC
SnPb(Ag) : IF 14-06, IF 14-09, IF 14-10, IF14-14 (continut de flux 0,6%, 0,9%,1,0% si 1,4%)
Fara Pb: continut de flux 1,6% si 2,2%

758

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CONTACTATI
SEDIUL CENTRAL
AL INTERFLUX

Interflux Electronics NV
Gent zeehaven 3170A
Eddastraat 51
9042 Gent
BELGIA

Telefon: +32 9251 4959
Fax: +32 9251 4970
info@interflux.com

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