Solder pastes
For lead-free soldering
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DP 5505
Interflux® DP 5505 is our all-round, high stability, no-clean solder paste in lead-free and SnPb(Ag) alloys.
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IF 9057
Interflux® IF 9057 is a no-clean solder paste in lead-free and SnPb(Ag) alloys developed for clear residues after reflow. It works very well for Pin-in-Paste (PiP) applications and in vapor phase soldering.
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IF 9009LT
Interflux® IF 9009LT is a no-clean solder paste with increased activity in both SnPb(Ag) and lead-free alloys.
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µ-dIFe 7
Interflux® µ-dIFe 7 is a no-clean, lead-free solder paste for dipping applications
For lead-based soldering
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DP 5505
Interflux® DP 5505 is our all-round, high stability, no-clean solder paste in lead-free and SnPb(Ag) alloys.
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IF 9057
Interflux® IF 9057 is a no-clean solder paste in lead-free and SnPb(Ag) alloys developed for clear residues after reflow. It works very well for Pin-in-Paste (PiP) applications and in vapor phase soldering.
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IF 9009LT
Interflux® IF 9009LT is a no-clean solder paste with increased activity in both SnPb(Ag) and lead-free alloys.
For low melting point soldering (LMPA)
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LMPA-Q7
Interflux LMPA-Q7 is a low melting point solder paste with optimised stencil performance and enhanced mechanical properties. LMPA-Q7 succeeds LMPA-Q6.
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LMPA-Q6
Interflux® LMPA-Q6 is a no-clean solder paste with the high reliability LMPA-Q low melting point alloy. LMPA-Q6 facilitates the use of temperature sensitive components and reduces production costs.
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DP 5600
Interflux® DP 5600 is a no-clean solder paste for low temperature SnBi(Ag) alloys.
RO L0 to EN and IPC standards
Sn42Bi57Ag1 (melting point 139°C ~ 282°F)
For reflow soldering
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LMPA-Q7
Interflux LMPA-Q7 is a low melting point solder paste with optimised stencil performance and enhanced mechanical properties. LMPA-Q7 succeeds LMPA-Q6.
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LMPA-Q6
Interflux® LMPA-Q6 is a no-clean solder paste with the high reliability LMPA-Q low melting point alloy. LMPA-Q6 facilitates the use of temperature sensitive components and reduces production costs.
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DP 5600
Interflux® DP 5600 is a no-clean solder paste for low temperature SnBi(Ag) alloys.
RO L0 to EN and IPC standards
Sn42Bi57Ag1 (melting point 139°C ~ 282°F) -
DP 5505
Interflux® DP 5505 is our all-round, high stability, no-clean solder paste in lead-free and SnPb(Ag) alloys.
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IF 9057
Interflux® IF 9057 is a no-clean solder paste in lead-free and SnPb(Ag) alloys developed for clear residues after reflow. It works very well for Pin-in-Paste (PiP) applications and in vapor phase soldering.
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µ-dIFe 7
Interflux® µ-dIFe 7 is a no-clean, lead-free solder paste for dipping applications
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IF 9009LT
Interflux® IF 9009LT is a no-clean solder paste with increased activity in both SnPb(Ag) and lead-free alloys.
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DP 5505 AT
The Interflux® DP 5505 AT is the Anti-Tombstone version of the DP 5505 solder paste.
Please check the DP 5505 product page:
https://app.interflux.com/en/product/DP-5505 -
Delphine 5503/2
Delphine 5503/2 has been replaced by IF 9057.
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LP 5720
LP 5720 has been replaced by IF 9057.
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Delphine 5503
Delphine 5503 has been replaced by IF 9057.
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Delphine 5504
Delphine 5504 has been replaced by DP 5505.
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DP 5505 IC
The DP 5505 IC is replaced by the DP 5505.
Please check the DP 5505 product page:
https://app.interflux.com/en/product/DP-5505 -
NX 9900
NX 9900 has been replaced by DP 5505.
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IF 9010
IF 9010 has been replaced by DP 5505.
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LP 5707
LP 5707 has been replaced by DP 5505.
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RTS 1804
Interflux® RTS 1804 is a no-clean, absolutely halide free solder paste for storage at room temperature in lead-free and SnPb(Ag) alloys.
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WSP 2006
Interflux ® WSP 2006 is an absolutely halide free solder paste with low corrosion water soluble residues after soldering. The residues of WSP 2006 need to be cleaned.
For stencil printing
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LMPA-Q7
Interflux LMPA-Q7 is a low melting point solder paste with optimised stencil performance and enhanced mechanical properties. LMPA-Q7 succeeds LMPA-Q6.
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LMPA-Q6
Interflux® LMPA-Q6 is a no-clean solder paste with the high reliability LMPA-Q low melting point alloy. LMPA-Q6 facilitates the use of temperature sensitive components and reduces production costs.
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DP 5600
Interflux® DP 5600 is a no-clean solder paste for low temperature SnBi(Ag) alloys.
RO L0 to EN and IPC standards
Sn42Bi57Ag1 (melting point 139°C ~ 282°F) -
DP 5505
Interflux® DP 5505 is our all-round, high stability, no-clean solder paste in lead-free and SnPb(Ag) alloys.
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IF 9057
Interflux® IF 9057 is a no-clean solder paste in lead-free and SnPb(Ag) alloys developed for clear residues after reflow. It works very well for Pin-in-Paste (PiP) applications and in vapor phase soldering.
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IF 9009LT
Interflux® IF 9009LT is a no-clean solder paste with increased activity in both SnPb(Ag) and lead-free alloys.
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RTS 1804
Interflux® RTS 1804 is a no-clean, absolutely halide free solder paste for storage at room temperature in lead-free and SnPb(Ag) alloys.
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Delphine 5503/2
Delphine 5503/2 has been replaced by IF 9057.
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LP 5720
LP 5720 has been replaced by IF 9057.
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Delphine 5503
Delphine 5503 has been replaced by IF 9057.
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DP 5505 AT
The Interflux® DP 5505 AT is the Anti-Tombstone version of the DP 5505 solder paste.
Please check the DP 5505 product page:
https://app.interflux.com/en/product/DP-5505 -
IF 9010
IF 9010 has been replaced by DP 5505.
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Delphine 5504
Delphine 5504 has been replaced by DP 5505.
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DP 5505 IC
The DP 5505 IC is replaced by the DP 5505.
Please check the DP 5505 product page:
https://app.interflux.com/en/product/DP-5505 -
LP 5707
LP 5707 has been replaced by DP 5505.
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NX 9900
NX 9900 has been replaced by DP 5505.
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WSP 2006
Interflux ® WSP 2006 is an absolutely halide free solder paste with low corrosion water soluble residues after soldering. The residues of WSP 2006 need to be cleaned.
For rework & repair
For solder paste jetting
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DP 5600
Interflux® DP 5600 is a no-clean solder paste for low temperature SnBi(Ag) alloys.
RO L0 to EN and IPC standards
Sn42Bi57Ag1 (melting point 139°C ~ 282°F) -
LMPA-Q6
Interflux® LMPA-Q6 is a no-clean solder paste with the high reliability LMPA-Q low melting point alloy. LMPA-Q6 facilitates the use of temperature sensitive components and reduces production costs.
For dispensing
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LMPA-Q7
Interflux LMPA-Q7 is a low melting point solder paste with optimised stencil performance and enhanced mechanical properties. LMPA-Q7 succeeds LMPA-Q6.
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LMPA-Q6
Interflux® LMPA-Q6 is a no-clean solder paste with the high reliability LMPA-Q low melting point alloy. LMPA-Q6 facilitates the use of temperature sensitive components and reduces production costs.
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IF 9009LT
Interflux® IF 9009LT is a no-clean solder paste with increased activity in both SnPb(Ag) and lead-free alloys.
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DP 5600
Interflux® DP 5600 is a no-clean solder paste for low temperature SnBi(Ag) alloys.
RO L0 to EN and IPC standards
Sn42Bi57Ag1 (melting point 139°C ~ 282°F) -
DP 5505
Interflux® DP 5505 is our all-round, high stability, no-clean solder paste in lead-free and SnPb(Ag) alloys.
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IF 9057
Interflux® IF 9057 is a no-clean solder paste in lead-free and SnPb(Ag) alloys developed for clear residues after reflow. It works very well for Pin-in-Paste (PiP) applications and in vapor phase soldering.
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DP 5505 AT
The Interflux® DP 5505 AT is the Anti-Tombstone version of the DP 5505 solder paste.
Please check the DP 5505 product page:
https://app.interflux.com/en/product/DP-5505 -
Delphine 5503/2
Delphine 5503/2 has been replaced by IF 9057.
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DP 5505 IC
The DP 5505 IC is replaced by the DP 5505.
Please check the DP 5505 product page:
https://app.interflux.com/en/product/DP-5505 -
WSP 2006
Interflux ® WSP 2006 is an absolutely halide free solder paste with low corrosion water soluble residues after soldering. The residues of WSP 2006 need to be cleaned.
For vapor phase soldering
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IF 9057
Interflux® IF 9057 is a no-clean solder paste in lead-free and SnPb(Ag) alloys developed for clear residues after reflow. It works very well for Pin-in-Paste (PiP) applications and in vapor phase soldering.
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LMPA-Q6
Interflux® LMPA-Q6 is a no-clean solder paste with the high reliability LMPA-Q low melting point alloy. LMPA-Q6 facilitates the use of temperature sensitive components and reduces production costs.