Solder pastes for reflow soldering

  1. DP 5505 SnAgCu 500g

    DP 5505

    high stability solder paste

    popular

    Interflux® DP 5505 is our all-round, high stability, no-clean solder paste in lead-free and SnPb(Ag) alloys.
  2. LMPA-Q6 #1

    LMPA-Q6

    low melting point solder paste

    popular

    Interflux® LMPA-Q6 is a no-clean solder paste with the high reliability LMPA-Q low melting point alloy. LMPA-Q6 facilitates the use of temperature sensitive components and reduces production costs.
  3. micro dIFe 7 µ- dIFe 7 SnAgCu type 5 30cc & 10cc & 5cc syringe with plunger 3

    µ-dIFe 7

    Dip solder paste

    Interflux® µ-dIFe 7 is a no-clean, lead-free solder paste for dipping applications
  4. DP 5600 solder paste SnBiAg 500g

    DP 5600

    Low melting point solder paste

    popular

    Interflux® DP 5600 is a no-clean solder paste for low temperature SnBi(Ag) alloys.
    RO L0 to EN and IPC standards
    Sn42Bi57Ag1 (melting point 139°C ~ 282°F)
  5. IF 9057 SnAgCu 500g jar 1

    IF 9057

    lead-free solder paste

    new

    Interflux® IF 9057 is a no-clean solder paste in lead-free and SnPb(Ag) alloys developed for clear residues after reflow. It works very well for Pin-in-Paste (PiP) applications and in vapor phase soldering.
  6. LMPA Q7 1kg cartridge

    LMPA-Q7

    low melting point solder paste

    new

    Interflux LMPA-Q7 is a low melting point solder paste with optimised stencil performance and enhanced mechanical properties. LMPA-Q7 succeeds LMPA-Q6.
  7. IF 9009LT SnAgCu 500g jar

    IF 9009LT

    activated solder paste

    Interflux® IF 9009LT is a no-clean solder paste with increased activity in both SnPb(Ag) and lead-free alloys.