Solder wires
For lead-based soldering
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IF 14
Interflux® IF 14 series are colophony free, absolutely halide-free, no-clean solder wires with easily removable residues in SnPb(Ag) and lead-free alloys.
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RosIX 705
Interflux® RosIX 705 is an activated rosin based, no-clean solder wire with increased wetting ability in lead-free and SnPb(Ag) alloys. RosIX 705 can be used on surfaces that are difficult to solder like e.g. OSP, Ni, Zn, brass, German silver, ... as well as on degraded and oxidized surfaces.
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Aquasol 4018
Interflux® Aquasol 4018 is a high activity solder wire with water soluble residues in SnPb and lead-free alloys. Very good wetting ability on surfaces with poor solderabilty. Residues must be cleaned.
Residues can be cleaned with DI water at 35°C-45°C (95°F— 114°F).
OR H1 to EN and IPC standards
Flux content: 2,5%
For lead-free soldering
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IF 14
Interflux® IF 14 series are colophony free, absolutely halide-free, no-clean solder wires with easily removable residues in SnPb(Ag) and lead-free alloys.
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IR 3
Interflux® IR 3 is an absolutely halide-free, lead-free, no-clean solder wire that has been developed for robot soldering. It provides low spattering, fast wetting, low soldering tip contamination and low residue. IR 3 can also be used for laser and hand soldering with the same advantages.
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NH 1
Interflux® NH 1 is an activated no-clean colophony free and lead-free solder wire that gives fast and repeatable soldering results on a wide range of surfaces including brass. NH 1 provides fast wetting and low spattering making it particularly suitable for robot and laser soldering but also for normal hand soldering.
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Flexsol 903
Interflux® Flexsol 903 is an absolutely halide-free, no-clean solder wire with reduced spattering properties in lead-free alloys.
RO L0 to EN and IPC standards
Flux content: 2,2% and 3,5% -
RosIX 705
Interflux® RosIX 705 is an activated rosin based, no-clean solder wire with increased wetting ability in lead-free and SnPb(Ag) alloys. RosIX 705 can be used on surfaces that are difficult to solder like e.g. OSP, Ni, Zn, brass, German silver, ... as well as on degraded and oxidized surfaces.
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QF 70
Interflux® QF 70 is an absolutely halide-free, no-clean lead-free solder wire with fast wetting for fast soldering operations. QF 70 can be used in both hand soldering and automated soldering processes.
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Aquasol 4018
Interflux® Aquasol 4018 is a high activity solder wire with water soluble residues in SnPb and lead-free alloys. Very good wetting ability on surfaces with poor solderabilty. Residues must be cleaned.
Residues can be cleaned with DI water at 35°C-45°C (95°F— 114°F).
OR H1 to EN and IPC standards
Flux content: 2,5%
For low melting point soldering (LMPA)
For rework & repair
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IF 14
Interflux® IF 14 series are colophony free, absolutely halide-free, no-clean solder wires with easily removable residues in SnPb(Ag) and lead-free alloys.
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Flexsol 903
Interflux® Flexsol 903 is an absolutely halide-free, no-clean solder wire with reduced spattering properties in lead-free alloys.
RO L0 to EN and IPC standards
Flux content: 2,2% and 3,5% -
QF 70
Interflux® QF 70 is an absolutely halide-free, no-clean lead-free solder wire with fast wetting for fast soldering operations. QF 70 can be used in both hand soldering and automated soldering processes.
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RosIX 705
Interflux® RosIX 705 is an activated rosin based, no-clean solder wire with increased wetting ability in lead-free and SnPb(Ag) alloys. RosIX 705 can be used on surfaces that are difficult to solder like e.g. OSP, Ni, Zn, brass, German silver, ... as well as on degraded and oxidized surfaces.
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IR 3
Interflux® IR 3 is an absolutely halide-free, lead-free, no-clean solder wire that has been developed for robot soldering. It provides low spattering, fast wetting, low soldering tip contamination and low residue. IR 3 can also be used for laser and hand soldering with the same advantages.
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NH 1
Interflux® NH 1 is an activated no-clean colophony free and lead-free solder wire that gives fast and repeatable soldering results on a wide range of surfaces including brass. NH 1 provides fast wetting and low spattering making it particularly suitable for robot and laser soldering but also for normal hand soldering.
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Aquasol 4018
Interflux® Aquasol 4018 is a high activity solder wire with water soluble residues in SnPb and lead-free alloys. Very good wetting ability on surfaces with poor solderabilty. Residues must be cleaned.
Residues can be cleaned with DI water at 35°C-45°C (95°F— 114°F).
OR H1 to EN and IPC standards
Flux content: 2,5% -
LMPA-Q hand soldering kit
The LMPA-Q hand soldering kit can be used for applications where slow soldering or poor through hole fill with Sn (Ag)Cu alloys are a problem. The hand soldering process with the kit will be faster and through hole fill much easier.
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i-Flex 400
i-Flex 400 has been replaced by IF 14.
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IF 1000M
IF 1000M has been replaced by RosIX 705.
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IF R88
IF R88 has been replaced by RosIX 705.
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Laser 25
Interflux® Laser 25 for lead-free alloys is a halide free no-clean solder wire with extremely low spattering properties.
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ResIF 435L1
ResIF 435L1 has been replaced by NH 1.
For hand soldering
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IF 14
Interflux® IF 14 series are colophony free, absolutely halide-free, no-clean solder wires with easily removable residues in SnPb(Ag) and lead-free alloys.
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Flexsol 903
Interflux® Flexsol 903 is an absolutely halide-free, no-clean solder wire with reduced spattering properties in lead-free alloys.
RO L0 to EN and IPC standards
Flux content: 2,2% and 3,5% -
QF 70
Interflux® QF 70 is an absolutely halide-free, no-clean lead-free solder wire with fast wetting for fast soldering operations. QF 70 can be used in both hand soldering and automated soldering processes.
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RosIX 705
Interflux® RosIX 705 is an activated rosin based, no-clean solder wire with increased wetting ability in lead-free and SnPb(Ag) alloys. RosIX 705 can be used on surfaces that are difficult to solder like e.g. OSP, Ni, Zn, brass, German silver, ... as well as on degraded and oxidized surfaces.
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Aquasol 4018
Interflux® Aquasol 4018 is a high activity solder wire with water soluble residues in SnPb and lead-free alloys. Very good wetting ability on surfaces with poor solderabilty. Residues must be cleaned.
Residues can be cleaned with DI water at 35°C-45°C (95°F— 114°F).
OR H1 to EN and IPC standards
Flux content: 2,5% -
IR 3
Interflux® IR 3 is an absolutely halide-free, lead-free, no-clean solder wire that has been developed for robot soldering. It provides low spattering, fast wetting, low soldering tip contamination and low residue. IR 3 can also be used for laser and hand soldering with the same advantages.
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NH 1
Interflux® NH 1 is an activated no-clean colophony free and lead-free solder wire that gives fast and repeatable soldering results on a wide range of surfaces including brass. NH 1 provides fast wetting and low spattering making it particularly suitable for robot and laser soldering but also for normal hand soldering.
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LMPA-Q hand soldering kit
The LMPA-Q hand soldering kit can be used for applications where slow soldering or poor through hole fill with Sn (Ag)Cu alloys are a problem. The hand soldering process with the kit will be faster and through hole fill much easier.
For robot soldering
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IR 3
Interflux® IR 3 is an absolutely halide-free, lead-free, no-clean solder wire that has been developed for robot soldering. It provides low spattering, fast wetting, low soldering tip contamination and low residue. IR 3 can also be used for laser and hand soldering with the same advantages.
-
NH 1
Interflux® NH 1 is an activated no-clean colophony free and lead-free solder wire that gives fast and repeatable soldering results on a wide range of surfaces including brass. NH 1 provides fast wetting and low spattering making it particularly suitable for robot and laser soldering but also for normal hand soldering.
-
Aquasol 4018
Interflux® Aquasol 4018 is a high activity solder wire with water soluble residues in SnPb and lead-free alloys. Very good wetting ability on surfaces with poor solderabilty. Residues must be cleaned.
Residues can be cleaned with DI water at 35°C-45°C (95°F— 114°F).
OR H1 to EN and IPC standards
Flux content: 2,5% -
RosIX 705
Interflux® RosIX 705 is an activated rosin based, no-clean solder wire with increased wetting ability in lead-free and SnPb(Ag) alloys. RosIX 705 can be used on surfaces that are difficult to solder like e.g. OSP, Ni, Zn, brass, German silver, ... as well as on degraded and oxidized surfaces.
For laser soldering
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NH 1
Interflux® NH 1 is an activated no-clean colophony free and lead-free solder wire that gives fast and repeatable soldering results on a wide range of surfaces including brass. NH 1 provides fast wetting and low spattering making it particularly suitable for robot and laser soldering but also for normal hand soldering.
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IR 3
Interflux® IR 3 is an absolutely halide-free, lead-free, no-clean solder wire that has been developed for robot soldering. It provides low spattering, fast wetting, low soldering tip contamination and low residue. IR 3 can also be used for laser and hand soldering with the same advantages.