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Low melting point soldering – LMPA-Q OSP soldering Selective soldering Jet fluxing Hand soldering Wave soldering Solder paste jetting Robot soldering Reflow soldering Spray fluxing Laser soldering Stencil printing Foam fluxing Dispensing Rework & repair Pre-tinning Solder bath conditioning Vapor phase soldering Dip soldering Cleaning
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    LMPA-Q Soldering fluxes Solder pastes Solder wires Solder alloys Auxiliaries Fluxing systems All products
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    Low melting point soldering – LMPA-Q OSP soldering Selective soldering Jet fluxing Hand soldering Wave soldering Solder paste jetting Robot soldering Reflow soldering Spray fluxing Laser soldering Stencil printing Foam fluxing Dispensing Rework & repair Pre-tinning Solder bath conditioning Vapor phase soldering Dip soldering Cleaning
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Solder wires
Suitable for
Lead-based soldering

Solder wires for lead-based soldering

  1. Aquasol 4018 solder wire SnAgCu 500g

    Aquasol 4018

    Water soluble solder wire

    Interflux® Aquasol 4018 is a high activity solder wire with water soluble residues in SnPb and lead-free alloys. Very good wetting ability on surfaces with poor solderabilty. Residues must be cleaned.
    Residues can be cleaned with DI water at 35°C-45°C (95°F— 114°F).
     OR H1 to EN and IPC standards
     Flux content: 2,5%

  2. IF 14-22 Sn99Qc 500g

    IF 14

    solder wire

    popular

    Interflux® IF 14 series are colophony free, absolutely halide-free, no-clean solder wires with easily removable residues in SnPb(Ag) and lead-free  alloys.

  3. RosIX 705 SnAgCu 500g

    RosIX 705

    Activated solder wire

    new

    Interflux® RosIX 705 is an activated rosin based, no-clean solder wire with increased wetting ability in lead-free and SnPb(Ag) alloys. RosIX 705 can be used on surfaces that are difficult to solder like e.g. OSP, Ni, Zn, brass, German silver, ... as well as on degraded and oxidized surfaces.

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