Products for jet fluxing
Soldering fluxes for jet fluxing
PacIFic 2009MLF-E is a water based no-clean flux which combines low residue levels after soldering with reduced micro solder ball formation.
Interflux® IF 3006 is a resin- and rosin free, no-clean soldering flux with a reduced VOC content.
Interflux® IF 2005K with 2,5% of solids is a resin- and rosin-free, no-clean soldering flux. It can be used when the soldering process needs more activation than IF 2005M provides.
IF 2005K is preferred for lead-free wave soldering but is also suitable for selective soldering and SnPb wave soldering.
Interflux® IF 2005M is the internationally renowned resin- and rosin-free, no-clean / No-residue™ flux standard.
Interflux® PacIFic 2010F is a water based no-clean soldering flux for foam fluxing applications. PacIFic 2010F provides low residues after soldering.
PacIFic 2009MLF is a water based no-clean soldering flux developed to minimize micro solder ball formation.
Interflux® PacIFic 2009M is a water based no-clean flux mainly used for wave soldering but also for selective soldering and tinning. PacIFic 2009M has a long history of use in virtually all electronic branches worldwide.
Interflux® AF 4818 PbF is a solvent based, rosin containing, no-clean soldering flux with increased solid content and a large process window.
It provides increased chances to pass harsh environmental tests as sometimes required in the automotive industry.
Interflux® SelectIF 2040 is a water based no-clean selective soldering flux with a wide process window and low residue formation.
Interflux® IF 2005C with 3,3% of solids is a resin- and rosin-free, no-clean soldering flux. It can be used when the soldering process needs more activation than IF 2005M or IF 2005K provide.
IF 2005C is preferred for selective soldering but can be used for wave and dip soldering too.
OR L0 according to EN and IPC standards
Fluxing systems for jet fluxing
The Revolutionary Selective Jet Fluxer is designed to control the amount of flux for each solder joint without losing the ability to maintain the required cycle time demanded by wave soldering processes. The Jet technology used replaces completely the need of spray technology. As a result, the ICSF-Select offers a Total Flux Process control needed for today’s more demanding and complicated soldering requirements, especially lead-free processes. The ability to program points, lines, multi-lines, areas allows the engineer to decide how much flux/pressure is required for certain solder joints up to complete areas. This capability opens up the process window without risking excess of flux residues. Thanks to the XY-movement speed up to 1,500 mm/s, the cycle time will be up to the standard required for wave soldering mass production.