Products for lead-based soldering
Solder alloys for lead-based soldering
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Solder Bars
Interflux® Solder Bars are made from high purity, low oxidation metals in SnPb(Ag), lead-free and LMPA-Q alloys.
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Plain Solder Wires
Interflux® plain solder wire for automatic solder feeding on selective soldering systems in lead-free and SnPb(Ag) alloys and in the LMPA-Q alloy. Standard diameters are 2mm and 3mm on a 4kg role.
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Solder Pellets
Interflux® Solder Pellets are small pieces of solder for easy solder bath filling in lead-free and SnPb(Ag) alloys.
Solder wires for lead-based soldering
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Aquasol 4018
Interflux® Aquasol 4018 is a high activity solder wire with water soluble residues in SnPb and lead-free alloys. Very good wetting ability on surfaces with poor solderabilty. Residues must be cleaned.
Residues can be cleaned with DI water at 35°C-45°C (95°F— 114°F).
OR H1 to EN and IPC standards
Flux content: 2,5% -
IF 14
Interflux® IF 14 series are colophony free, absolutely halide-free, no-clean solder wires with easily removable residues in SnPb(Ag) and lead-free alloys.
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RosIX 705
Interflux® RosIX 705 is an activated rosin based, no-clean solder wire with increased wetting ability in lead-free and SnPb(Ag) alloys. RosIX 705 can be used on surfaces that are difficult to solder like e.g. OSP, Ni, Zn, brass, German silver, ... as well as on degraded and oxidized surfaces.
Solder pastes for lead-based soldering
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DP 5505
Interflux® DP 5505 is our all-round, high stability, no-clean solder paste in lead-free and SnPb(Ag) alloys.
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IF 9057
Interflux® IF 9057 is a no-clean solder paste in lead-free and SnPb(Ag) alloys developed for clear residues after reflow. It works very well for Pin-in-Paste (PiP) applications and in vapor phase soldering.
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IF 9009LT
Interflux® IF 9009LT is a no-clean solder paste with increased activity in both SnPb(Ag) and lead-free alloys.