Products for solder paste jetting

Interflux^® DP 5600 is a no-clean solder paste for low temperature SnBi(Ag) alloys.
RO L0 to EN and IPC standards
Sn42Bi57Ag1 (melting point 139°C ~ 282°F)

Interflux^® LMPA-Q6 is a no-clean solder paste with the high reliability LMPA-Q low melting point alloy. LMPA-Q6 facilitates the use of temperature sensitive components and reduces production costs.

Interflux^® Purgel is a neutral cleaner/conditioner for pumps and valves of dispensing systems that cleans and preserves dispensing system parts when not in use.