Alcohol-
based
Soldering fluxes

OSPI 3311M soldering flux

OSPI 3311M

NEW

  • Alcohol based flux

  • For wave soldering

  • Absolutely halide-free

  • High deoxidation power

  • For soldering OSP

Interflux® OSPI 3311M is an alcohol based no-clean flux for soldering OSP finished boards that have passed one or more reflow cycles.

Interflux® OSPI 3311M is an alcohol based no-clean flux for soldering OSP finished boards that have passed one or more reflow cycles.
For lead-free and SnPb processes
OR L0 according to EN and IPC standards
Halide content: 0,00%

IF 2005M

  • Alcohol based

  • For wave soldering

  • Absolutely halide-free

  • High compatibility with conformal coating

  • No-residue ™

Interflux® IF 2005M is the internationally renowned resin- and rosin-free, no-clean / No-residue™ flux standard.

Interflux® IF 2005M is the internationally renowned resin- and rosin-free, no-clean / No-residue™ flux standard.
Interflux® IF 2005M is QPL- listed (approved to MIL-F-14256F).
SnPb and lead-free compatible
Suitable for spray and foam fluxing
OR L0 to EN and IPC standards
Solid content: 1,85% ±0,15
Halide content: 0,00%

IF 2005K

IF 2005K

  • Alcohol based

  • For wave soldering

  • Absolutely halide-free

  • High compatibility with conformal coating

  • Low residue

Interflux® IF 2005K with 2,5% of solids is a resin- and rosin-free, no-clean flux. It can be used when the soldering process needs more activation than IF 2005M provides.

Interflux® IF 2005K with 2,5% of solids is a resin- and rosin-free, no-clean flux. It can be used when the soldering process needs more activation than IF 2005M provides.
SnPb and lead-free compatible
Suitable for spray and foam fluxing
OR L0 according to EN and IPC standards
Solid content: 2,5% ±0,3
Halide content: 0,00%

IF 2005C

IF 2005C

  • Alcohol based

  • For selective soldering

  • For pre-tinning

  • Absolutely halide-free

  • High deoxidation power

  • Long preheat resistant

  • High compatibility with conformal coating

Interflux® IF 2005C with 3,3% of solids is a resin- and rosin-free, no-clean flux. It can be used when the soldering process needs more activation than IF 2005M or IF 2005K provide.

Interflux® IF 2005C with 3,3% of solids is a resin- and rosin-free, no-clean flux. It can be used when the soldering process needs more activation than IF 2005M or IF 2005K provide.
SnPb and lead-free compatible
Suitable for spray and foam fluxing
OR L0 according to EN and IPC standards
Solid content: 3,3% ± 0,3
Halide content: 0,00%

VOC-free
Soldering fluxes

SelectIF 2040

SELECTIF 2040

NEW

  • Water based flux

  • For selective soldering

  • Absolutely halide-free

  • High deoxidation power

  • High temperature resistant

  • High compatibility with conformal coating

  • Low residue

Interflux® SelectIF 2040 is a water based no-clean selective soldering flux with a wide process window and low residue formation.

Interflux® SelectIF 2040 is a water based no-clean selective soldering flux with a wide process window and low residue formation.
Withstands high process temperatures and long process times.
For SnPb and lead-free processes
OR L0 according to EN and IPC standards
Solid content: 6,5% ±0,2
Halide content: 0,00%

PACIFIC 2009M

PACIFIC 2009M

  • Water based flux

  • For wave soldering

  • For selective soldering

  • For pre-tinning

  • For spray fluxing

  • Absolutely halide-free

  • High compatibility with conformal coating

  • Low residue

Interflux® PacIFic 2009M is a water based no-clean flux mainly used for wave and selective soldering.

Interflux® PacIFic 2009M is a water based no-clean flux mainly used for wave and selective soldering.
For SnPb and lead-free processes
OR L0 according to EN and IPC standards
Solid content: 3,7% ±0,15
Halide content: 0,00%

PACIFIC 2009MLF

PACIFIC 2009MLF

  • Water based flux

  • For wave soldering

  • For selective soldering

  • For spray fluxing

  • Absolutely halide-free

  • Anti solder ball formation

PacIFic 2009MLF is a water based no-clean soldering flux developed to minimize micro solder ball formation.

PacIFic 2009MLF is a water based no-clean soldering flux developed to minimize micro solder ball formation.
For SnPb and lead-free processes
Main field of use: wave soldering and selective soldering
OR L0 according to EN and IPC standards
Solid content: 3,6% ±0,2
Halide content: 0,00%

PACIFIC 2009MLF-E

PACIFIC 2009MLF-E

  • Water based flux

  • For wave soldering

  • For spray fluxing

  • Absolutely halide-free

  • Reduced residue

  • Reduced solder ball formation

PacIFic 2009MLF-E is a water based no-clean flux which combines low residue levels with reduced micro solder ball formation.

PacIFic 2009MLF-E is a water based no-clean flux which combines low residue levels with reduced micro solder ball formation.
For SnPb and lead-free processes
Main field of use: wave soldering
OR L0 according to EN and IPC standards
Solid content: 3,6% ±0,25
Halide content: 0,00%

PACIFIC 2010F

PACIFIC 2010F

  • Water based flux

  • For wave soldering

  • For spray fluxing

  • For foam fluxing

  • Absolutely halide-free

  • High compatibility with conformal coating

  • Low residue

PacIFic 2010F is a water based no-clean flux for foam fluxing applications.

PacIFic 2010F is a water based no-clean flux for foam fluxing applications.
For SnPb and lead-free wave soldering
OR L0 according to EN and IPC standards
Solid content: 2,5% ±0,15
Halide content: 0,00%

Low VOC
Soldering fluxes

IF 3006

IF 3006

  • Low VOC

  • For wave soldering

  • For selective soldering

  • For pre-tinning

  • Absolutely halide-free

  • High compatibility with conformal coating

Interflux® IF 3006 is a resin- and rosin free, no-clean soldering flux with a reduced VOC content.

Interflux® IF 3006 is a resin- and rosin free, no-clean soldering flux with a reduced VOC content.
For SnPb and lead-free processes
Also for pre-tinning
OR L0 according to EN and IPC standards
Solid content: 3,2% ±0,4
Halide content: 0,00%

Rosin-
based
Soldering fluxes

AF 4818PbF

AF 4818 PBF

  • Contains rosin

  • Alcohol based

  • For wave soldering

  • For spray fluxing

  • Absolutely halide-free

  • High deoxidation power

  • Long preheat resistant

Interflux® AF 4818 PbF is a solvent based, rosin containing, no-clean soldering flux with increased solid content and a large process window.

Interflux® AF 4818 PbF is a solvent based, rosin containing, no-clean soldering flux with increased solid content and a large process window.
For SnPb and lead-free wave soldering processes
RO L0 according to EN and IPC standards
Solid content: 5%
Halide content: 0,00%

Rework & Repair
Soldering fluxes

IF 8300

IF 8300 SERIES

  • For rework & repair

  • For reflow soldering

  • For dispensing

  • For stencil printing

  • For dipping

  • Absolutely halide-free

  • Low residue

Interflux® IF 8300 is a no-clean, halide-free tacky gel flux.

Interflux® IF 8300 is a no-clean, halide-free tacky gel flux.
For SnPb and lead-free processes
Suitable for reballing and BGA rework
RE L0 to EN and IPC standards
Halide content: 0,00%
3 different viscosities:
IF 8300 : 210 kcps
IF 8300-4 : 70 kcps
IF 8300-6 : 25 kcps

Interflux IF7500HAB solder fluxInterflux IF7500HAB solder flux

IF 7500HAB

  • For rework & repair

  • For reflow soldering

  • For dispensing

  • For stencil printing

  • For dipping

  • Absolutely halide-free

  • Long profile resistant

  • High deoxidation power

  • Contains rosin

Interflux® IF 7500HAB is a no-clean, halide-free tacky gel flux with increased process window.

Interflux® IF 7500HAB is a no-clean, halide-free tacky gel flux with increased process window.
For SnPb and lead-free processes
Suitable for reballing and BGA rework
RO M0 to EN and IPC standards.
Halide content: 0,00%
Viscosity: 200 kcps

IF 8001

IF 8001

  • Alcohol based flux

  • For rework & repair

  • Absolutely halide-free

  • Low residue

Interflux® IF 8001 is a solvent based, no-clean soldering flux with low residue formation for selective fluxing applications.

Interflux® IF 8001 is a solvent based, no-clean soldering flux with low residue formation for selective fluxing applications.
For SnPb and lead-free processes
Main field of use: hand soldering. Other fields of use: automated soldering, stamp soldering, etc...
RE L0 to EN and IPC standards
Halide content: 0,00%
IF 8001 is available in refillable and non refillable flux pens.

IF 6000

  • Alcohol based

  • For rework & repair

  • Absolutely halide-free

  • Contains rosin

  • High deoxidation power

  • Long preheat resistant

Interflux® IF 6000 is a rosin containing, no-clean soldering flux with increased process window for selective fluxing applications.

Interflux® IF 6000 is a rosin containing, no-clean soldering flux with increased process window for selective fluxing applications.
For SnPb and lead-free processes
Main field of use: hand soldering. Other fields of use: automated soldering, stamp soldering, BGA rework, wafer bumping, etc...
RO L0 to EN and IPC standards
Halide content: 0,00%
IF 6000 is available in refillable and non refillable flux pens.

TERRIFIC RP65

  • Water based flux

  • For rework & repair

  • Absolutely halide-free

  • Long preheat resistant

TerrIFic RP65 is a water based, no-clean soldering flux for selective fluxing applications.

TerrIFic RP65 is a water based, no-clean soldering flux for selective fluxing applications.
For SnPb and lead-free processes
Main field of use: hand soldering. Other fields of use: automated soldering, stamp soldering, etc...
OR L0 to EN and IPC standards
Halide content: 0,00%
TerrIFic RP 65 is available in refillable and non refillable flux pens.

FLUX THINNERS

Interflux T2005M thinnerInterflux T2005M thinner

T 2005M

  • Alcohol based

  • Absolutely halide-free

  • For the IF 2005-series fluxes

Interflux® T 2005M is the thinner / conditioner for the IF 2005-series fluxes.

Interflux® T 2005M is the thinner / conditioner for the IF 2005-series fluxes.
When used in foam fluxing or other open flux applications.

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