Products for reflow soldering

Soldering fluxes for reflow soldering

IF 7500 HAB

Large process window tacky gel flux

Interflux^® IF 7500HAB is a no-clean, halide-free tacky gel flux with increased process window. Suitable for reballing and BGA rework.
IF 8300

Low residue tacky gel flux

Interflux^® IF 8300 is a no-clean, halide-free tacky gel flux suitable for reballing and BGA rework.

Solder pastes for reflow soldering

DP 5505

high stability solder paste

popular

Interflux^® DP 5505 is our all-round, high stability, no-clean solder paste in lead-free and SnPb(Ag) alloys.
LMPA-Q6

low melting point solder paste

popular

Interflux^® LMPA-Q6 is a no-clean solder paste with the high reliability LMPA-Q low melting point alloy. LMPA-Q6 facilitates the use of temperature sensitive components and reduces production costs.
µ-dIFe 7

Dip solder paste

Interflux^® µ-dIFe 7 is a no-clean, lead-free solder paste for dipping applications
DP 5600

Low melting point solder paste

popular

Interflux^® DP 5600 is a no-clean solder paste for low temperature SnBi(Ag) alloys.
RO L0 to EN and IPC standards
Sn42Bi57Ag1 (melting point 139°C ~ 282°F)
IF 9057

lead-free solder paste

new

Interflux^® IF 9057 is a no-clean solder paste in lead-free and SnPb(Ag) alloys developed for clear residues after reflow. It works very well for Pin-in-Paste (PiP) applications and in vapor phase soldering.
LMPA-Q7

low melting point solder paste

new

Interflux LMPA-Q7 is a low melting point solder paste with optimised stencil performance and enhanced mechanical properties. LMPA-Q7 succeeds LMPA-Q6.
IF 9009LT

activated solder paste

Interflux^® IF 9009LT is a no-clean solder paste with increased activity in both SnPb(Ag) and lead-free alloys.

Auxiliaries for reflow soldering