Products for stencil printing

Soldering fluxes for stencil printing

  1. IF 8300 11

    IF 8300

    Low residue tacky gel flux

    Interflux® IF 8300 is a no-clean, halide-free tacky gel flux suitable for reballing and BGA rework.
  2. IF 7500 HAB 4

    IF 7500 HAB

    Large process window tacky gel flux

    Interflux® IF 7500HAB is a no-clean, halide-free tacky gel flux with increased process window. Suitable for reballing and BGA rework.

Auxiliaries for stencil printing

  1. ISC 8020 10L angle

    ISC 8020

    stencil cleaning liquid

    Interflux® ISC 8020 is a stencil cleaning liquid for the removal of solder paste and uncured SMT adhesives in stencil printers. ISC 8020 has been designed not to interfere with solder paste rheology.
  2. Stencil Clean Wipes jar 2

    Stencil Clean Wipes

    stencil cleaning wipes

    Interflux® pre-saturated stencil clean wipes in flip-top tubs and refill bags for the removal of solder paste and non cured SMT adhesive from stencils and tools.

Solder pastes for stencil printing

  1. LMPA-Q6 #1

    LMPA-Q6

    low melting point solder paste

    popular

    Interflux® LMPA-Q6 is a no-clean solder paste with the high reliability LMPA-Q low melting point alloy. LMPA-Q6 facilitates the use of temperature sensitive components and reduces production costs.
  2. IF 9057 SnAgCu 500g jar 1

    IF 9057

    lead-free solder paste

    new

    Interflux® IF 9057 is a no-clean solder paste in lead-free and SnPb(Ag) alloys developed for clear residues after reflow. It works very well for Pin-in-Paste (PiP) applications and in vapor phase soldering.
  3. DP 5505 SnAgCu 500g

    DP 5505

    high stability solder paste

    popular

    Interflux® DP 5505 is our all-round, high stability, no-clean solder paste in lead-free and SnPb(Ag) alloys.
  4. DP 5600 solder paste SnBiAg 500g

    DP 5600

    Low melting point solder paste

    popular

    Interflux® DP 5600 is a no-clean solder paste for low temperature SnBi(Ag) alloys.
    RO L0 to EN and IPC standards
    Sn42Bi57Ag1 (melting point 139°C ~ 282°F)
  5. IF 9009LT SnAgCu 500g jar

    IF 9009LT

    activated solder paste

    Interflux® IF 9009LT is a no-clean solder paste with increased activity in both SnPb(Ag) and lead-free alloys.
  6. LMPA Q7 1kg cartridge

    LMPA-Q7

    low melting point solder paste

    new

    Interflux LMPA-Q7 is a low melting point solder paste with optimised stencil performance and enhanced mechanical properties. LMPA-Q7 succeeds LMPA-Q6.