Products for selective soldering

PacIFic 2009MLF is a water based no-clean soldering flux developed to minimize micro solder ball formation.

Interflux^® IF 2005C with 3,3% of solids is a resin- and rosin-free, no-clean soldering flux. It can be used when the soldering process needs more activation than IF 2005M or IF 2005K provide.
IF 2005C is preferred for selective soldering but can be used for wave and dip soldering too.

OR L0 according to EN and IPC standards

Interflux^® IF 2005K with 2,5% of solids is a resin- and rosin-free, no-clean soldering flux. It can be used when the soldering process needs more activation than IF 2005M provides.
IF 2005K is preferred for lead-free wave soldering but is also suitable for selective soldering and SnPb wave soldering.

Interflux^® IF 3006 is a resin- and rosin free, no-clean soldering flux with a reduced VOC content.

PacIFic 2009MLF-E is a water based no-clean flux which combines low residue levels after soldering with reduced micro solder ball formation.

Interflux^® plain solder wire for automatic solder feeding on selective soldering systems in lead-free and SnPb(Ag) alloys and in the LMPA-Q alloy. Standard diameters are 2mm and 3mm on a 4kg role.

Solder stones are convexly shaped pieces of LMPA-Q solder with dimensions of +/- d:37mm and H: 15mm for easy solder bath filling. The standard package is a 2,5kg plastic jar.

Interflux^® Solder Pellets are small pieces of solder for easy solder bath filling in lead-free and SnPb(Ag) alloys.

Interflux^® Solder Bars are made from high purity, low oxidation metals in SnPb(Ag), lead-free and LMPA-Q alloys.

Solder rods are ø 5mm X +/- 320mm (+/- 52g) pieces of LMPA-Q solder alloy in a 15kg box.

LMPA-Oil is a maintenance oil for the non wettable parts of soldering nozzles and for pump shafts when using the LMPA-Q low melting point soldering alloy in wave or selective soldering machines. LMPA-Oil will inhibit the solder to adhere to the surfaces and cause obstruction of the solder flow.