Soldering fluxes for foam fluxing

  1. IF 2005C 1L

    IF 2005C

    Selective soldering flux

    Interflux® IF 2005C with 3,3% of solids is a resin- and rosin-free, no-clean soldering flux. It can be used when the soldering process needs more activation than IF 2005M or IF 2005K provide.
    IF 2005C is preferred for selective soldering but can be used for wave and dip soldering too.

    OR L0 according to EN and IPC standards
  2. IF 2005K 10L angle

    IF 2005K

    Low residue soldering flux

    Interflux® IF 2005K with 2,5% of solids is a resin- and rosin-free, no-clean soldering flux. It can be used when the soldering process needs more activation than IF 2005M provides.
    IF 2005K is preferred for lead-free wave soldering but is also suitable for selective soldering and SnPb wave soldering.
  3. T 2005M 10L angle

    T 2005M

    flux thinner

    Interflux® T 2005M is the designated thinner for the IF 2005-series of fluxes. Flux thinning is typically done in open flux systems that involve evaporation of the flux solvent like in foam fluxing.
  4. IF 3006 10L angle

    IF 3006

    Reduced VOC soldering flux

    Interflux® IF 3006 is a resin- and rosin free, no-clean soldering flux with a reduced VOC content.
  5. IF 2005M 10L angle

    IF 2005M

    No-Residue™ soldering flux

    popular

    Interflux® IF 2005M is the internationally renowned resin- and rosin-free, no-clean / No-residue™ flux standard.
  6. PacIFic 2010F 10L angle

    PacIFic 2010F

    Foamable water based soldering flux

    Interflux® PacIFic 2010F is a water based no-clean soldering flux for foam fluxing applications. PacIFic 2010F provides low residues after soldering.