Products for selective soldering
Soldering fluxes for selective soldering
Interflux® PacIFic 2009M is a water based no-clean flux mainly used for wave soldering but also for selective soldering and tinning. PacIFic 2009M has a long history of use in virtually all electronic branches worldwide.
PacIFic 2009MLF is a water based no-clean soldering flux developed to minimize micro solder ball formation.
Interflux® IF 2005C with 3,3% of solids is a resin- and rosin-free, no-clean soldering flux. It can be used when the soldering process needs more activation than IF 2005M or IF 2005K provide.
IF 2005C is preferred for selective soldering but can be used for wave and dip soldering too.
OR L0 according to EN and IPC standards
Interflux® SelectIF 2040 is a water based no-clean selective soldering flux with a wide process window and low residue formation.
Interflux® IF 2005K with 2,5% of solids is a resin- and rosin-free, no-clean soldering flux. It can be used when the soldering process needs more activation than IF 2005M provides.
IF 2005K is preferred for lead-free wave soldering but is also suitable for selective soldering and SnPb wave soldering.
Interflux® OSPI 3311M is an alcohol based no-clean flux for soldering OSP finished boards that have passed one or more reflow cycles. OSPI 3311M provides optimised through hole fill on degraded OSP finishes.
Interflux® IF 2005M is the internationally renowned resin- and rosin-free, no-clean / No-residue™ flux standard.
Interflux® IF 3006 is a resin- and rosin free, no-clean soldering flux with a reduced VOC content.
PacIFic 2009MLF-E is a water based no-clean flux which combines low residue levels after soldering with reduced micro solder ball formation.
IF 3006K has been replaced by IF 3006.
Interflux ® WSF 1100 is a VOC-free, absolutely halide free soldering flux with low corrosion water soluble residues after soldering. The residues of WSF 1100 need to be cleaned
Interflux® LMPA™-S is an absolutely halide free no-clean soldering flux designed to reduce micro solder balling on solder ball sensitive solder masks when selective soldering with the low melting point alloy LMPA™-Q.
OSPI 3311 has been replaced by OSPI 3311M.
PacIFic 2008plus has been replaced by PacIFic 2009M.
PacIFic 2008 has been replaced by PacIFic 2009M.
PacIFic 2011F has been replaced by PacIFic 2009M.
Interflux ® WSF 7700 is a VOC-free, absolutely halide free soldering flux with low corrosion water soluble residues after soldering. The residues of WSF 7700 need to be cleaned
IF 2005-2,5% has been replaced by IF 2005K.
Solder alloys for selective soldering
Plain Solder Wires
Interflux® plain solder wire for automatic solder feeding on selective soldering systems in lead-free and SnPb(Ag) alloys and in the LMPA-Q alloy. Standard diameters are 2mm and 3mm on a 4kg role.
Solder stones are convexly shaped pieces of LMPA-Q solder with dimensions of +/- d:37mm and H: 15mm for easy solder bath filling. The standard package is a 2,5kg plastic jar.
Interflux® Solder Pellets are small pieces of solder for easy solder bath filling in lead-free and SnPb(Ag) alloys.
Interflux® Solder Bars are made from high purity, low oxidation metals in SnPb(Ag), lead-free and LMPA-Q alloys.
Solder rods are ø 5mm X +/- 320mm (+/- 52g) pieces of LMPA-Q solder alloy in a 15kg box.
Auxiliaries for selective soldering
Interflux® IF 930 cleans and de-oxidizes wettable nozzles of selective soldering systems. IF 930 replaces IF 920.
LMPA-Oil is a maintenance oil for the non wettable parts of soldering nozzles and for pump shafts when using the LMPA-Q low melting point soldering alloy in wave or selective soldering machines. LMPA-Oil will inhibit the solder to adhere to the surfaces and cause obstruction of the solder flow.