Solder 5 times faster whilst maintaining zero defects
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Speed: 30 mm/s
Alcohol based
For selective soldering
For pre-tinning
Absolutely halide-free
High deoxidation power
Long preheat resistant
High compatibility with conformal coating
Interflux® IF 2005C with 3,3% of solids is a resin- and rosin-free, no-clean flux. It can be used when the soldering process needs more activation than IF 2005M or IF 2005K provide.
Interflux® IF 2005C with 3,3% of solids is a resin- and rosin-free, no-clean flux. It can be used when the soldering process needs more activation than IF 2005M or IF 2005K provide.
SnPb and lead-free compatible
Suitable for spray and foam fluxing
OR L0 according to EN and IPC standards
Solid content: 3,3% ± 0,3
Halide content: 0,00%
Water based flux
For wave soldering
For selective soldering
For pre-tinning
For spray fluxing
Absolutely halide-free
High compatibility with conformal coating
Low residue
Interflux® PacIFic 2009M is a water based no-clean flux mainly used for wave and selective soldering.
Interflux® PacIFic
2009M is a water based no-clean flux mainly used for wave and selective soldering.
For SnPb and lead-free processes
OR L0 according to EN and IPC standards
Solid content: 3,7% ±0,15
Halide content: 0,00%
Low VOC
For wave soldering
For selective soldering
For pre-tinning
Absolutely halide-free
High compatibility with conformal coating
Interflux® IF 3006 is a resin- and rosin free, no-clean soldering flux with a reduced VOC content.
Interflux® IF 3006 is a resin- and rosin free, no-clean soldering flux with a reduced VOC content.
For SnPb and lead-free processes
Also for pre-tinning
OR L0 according to EN and IPC standards
Solid content: 3,2% ±0,4
Halide content: 0,00%
For wave soldering
For pre-tinning
For dipping
For SnPb(Ag) alloys
For lead-free alloys
Interflux® IF 910 de-oxidation oil separates oxides from good solder in a solder bath.
Interflux® IF 910 de-oxidation oil separates oxides from good solder in a solder bath.
Reduces solder consumption.
For wave soldering
For selective soldering
For pre-tinning
For SnPb(Ag) processes
For lead-free processes
Interflux® Anti-oxidant pellets minimize the formation of oxides on lead-free and SnPb(Ag) solder baths.
Interflux® Anti-oxidant pellets minimize the formation of oxides on lead-free and SnPb(Ag) solder baths.
Used as an addition in the solder bath
For SnPb(Ag) (blue label) or lead-free (green label) alloys
Anti-oxidant pellets are not recommended under closed inert atmospheres
nor for Ni-doped solder alloys.
For wave soldering
For selective soldering
For pre-tinning
For dip soldering
Interflux® Solder Bars are made from high purity, low oxidation metals in SnPb(Ag) and lead-free alloys.
Interflux® Solder Bars are made from high purity, low oxidation metals in SnPb(Ag) and lead-free alloys.
For selective soldering
For pre-tinning
For dip soldering
Interflux® plain solder wire for automatic solder feeding on selective soldering systems in lead-free and SnPb(Ag) alloys.
Interflux® plain solder wire for automatic solder feeding on selective soldering systems in lead-free and SnPb(Ag) alloys.
Wire diameter: 2mm/ 3mm
On 4kg/ 1kg spools
4kg spool size: 125mm x 125mm (dia.x length)
For wave soldering
For selective soldering
For rework & repair
For pre-tinning
For dipping
Interflux® Solder Pellets are small pieces of solder for easy solder bath filling in lead-free and SnPb(Ag) alloys.
Interflux® Solder Pellets are small pieces of solder for easy solder bath filling in lead-free and SnPb(Ag) alloys.
Size: 1cm x 1cm approx.
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