Products for wave soldering
Soldering fluxes for wave soldering
Interflux® IF 2005C with 3,3% of solids is a resin- and rosin-free, no-clean soldering flux. It can be used when the soldering process needs more activation than IF 2005M or IF 2005K provide.
IF 2005C is preferred for selective soldering but can be used for wave and dip soldering too.
OR L0 according to EN and IPC standards
Interflux® IF 3006 is a resin- and rosin free, no-clean soldering flux with a reduced VOC content.
Interflux® PacIFic 2010F is a water based no-clean soldering flux for foam fluxing applications. PacIFic 2010F provides low residues after soldering.
Interflux® IF 2005M is the internationally renowned resin- and rosin-free, no-clean / No-residue™ flux standard.
Interflux® IF 2005K with 2,5% of solids is a resin- and rosin-free, no-clean soldering flux. It can be used when the soldering process needs more activation than IF 2005M provides.
IF 2005K is preferred for lead-free wave soldering but is also suitable for selective soldering and SnPb wave soldering.
Interflux® AF 4818 PbF is a solvent based, rosin containing, no-clean soldering flux with increased solid content and a large process window.
It provides increased chances to pass harsh environmental tests as sometimes required in the automotive industry.
Interflux® PacIFic 2009M is a water based no-clean flux mainly used for wave soldering but also for selective soldering and tinning. PacIFic 2009M has a long history of use in virtually all electronic branches worldwide.
PacIFic 2009MLF-E is a water based no-clean flux which combines low residue levels after soldering with reduced micro solder ball formation.
PacIFic 2009MLF is a water based no-clean soldering flux developed to minimize micro solder ball formation.
Interflux® OSPI 3311M is an alcohol based no-clean flux for soldering OSP finished boards that have passed one or more reflow cycles. OSPI 3311M provides optimised through hole fill on degraded OSP finishes.
Interflux ® WSF 7700 is a VOC-free, absolutely halide free soldering flux with low corrosion water soluble residues after soldering. The residues of WSF 7700 need to be cleaned
PacIFic 2008 has been replaced by PacIFic 2009M.
TS 18 has been replaced by IF 2005M.
IF 2005 has been replaced by IF 2005M.
OSPI 3311 has been replaced by OSPI 3311M.
PacIFic 2011F has been replaced by PacIFic 2009M.
Interflux ® WSF 1100 is a VOC-free, absolutely halide free soldering flux with low corrosion water soluble residues after soldering. The residues of WSF 1100 need to be cleaned
PacIFic 2008plus has been replaced by PacIFic 2009M.
IF 3006K has been replaced by IF 3006.
TS 33R has been replaced by AF 4818-PbF.
PacIFic 2007 has been replaced by PacIFic 2009M.
PacIFic 2009 has been replaced by PacIFic 2010F.
TS 15 has been replaced by IF 2005M.
TS 33 has been replaced by IF 2005C.
IF 2005-2,5% has been replaced by IF 2005K.
Solder alloys for wave soldering
Solder rods are ø 5mm X +/- 320mm (+/- 52g) pieces of LMPA-Q solder alloy in a 15kg box.
Interflux® Solder Bars are made from high purity, low oxidation metals in SnPb(Ag), lead-free and LMPA-Q alloys.
Interflux® Solder Pellets are small pieces of solder for easy solder bath filling in lead-free and SnPb(Ag) alloys.
Solder stones are convexly shaped pieces of LMPA-Q solder with dimensions of +/- d:37mm and H: 15mm for easy solder bath filling. The standard package is a 2,5kg plastic jar.
Auxiliaries for wave soldering
Interflux® IF 910 de-oxidation oil separates oxides from good solder in a solder bath. It can drastically reduce the solder consumption.
LMPA-Oil is a maintenance oil for the non wettable parts of soldering nozzles and for pump shafts when using the LMPA-Q low melting point soldering alloy in wave or selective soldering machines. LMPA-Oil will inhibit the solder to adhere to the surfaces and cause obstruction of the solder flow.
Interflux® IF 710 PSM is a natural latex based, fast curing peelable solder mask. To shield areas on a PCB from flux and solder wave contact.
Interflux® Anti-oxidant pellets minimize the formation of oxides on lead-free and SnPb(Ag) solder baths. Used as an addition in the solder bath.
The product is not recommended to be used in closed nitrogen machines nor in combination with Ni-doped soldering alloys.
Fluxing systems for wave soldering
The InterSpray Curve series are designed to retrofit all existing soldering machines with a reliable spray fluxer which offers excellent results. The InterSpray Curve 2 double nozzle series are designed to use 2 different types of fluxes in 1 reliable spray fluxer system.
The Revolutionary Selective Jet Fluxer is designed to control the amount of flux for each solder joint without losing the ability to maintain the required cycle time demanded by wave soldering processes. The Jet technology used replaces completely the need of spray technology. As a result, the ICSF-Select offers a Total Flux Process control needed for today’s more demanding and complicated soldering requirements, especially lead-free processes. The ability to program points, lines, multi-lines, areas allows the engineer to decide how much flux/pressure is required for certain solder joints up to complete areas. This capability opens up the process window without risking excess of flux residues. Thanks to the XY-movement speed up to 1,500 mm/s, the cycle time will be up to the standard required for wave soldering mass production.