Products for low melting point soldering (LMPA)
Solder pastes for low melting point soldering (LMPA)
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LMPA-Q6
Interflux® LMPA-Q6 is a no-clean solder paste with the high reliability LMPA-Q low melting point alloy. LMPA-Q6 facilitates the use of temperature sensitive components and reduces production costs.
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LMPA-Q7
Interflux LMPA-Q7 is a low melting point solder paste with optimised stencil performance and enhanced mechanical properties. LMPA-Q7 succeeds LMPA-Q6.
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DP 5600
Interflux® DP 5600 is a no-clean solder paste for low temperature SnBi(Ag) alloys.
RO L0 to EN and IPC standards
Sn42Bi57Ag1 (melting point 139°C ~ 282°F)
Solder alloys for low melting point soldering (LMPA)
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Solder Stones
Solder stones are convexly shaped pieces of LMPA-Q solder with dimensions of +/- d:37mm and H: 15mm for easy solder bath filling. The standard package is a 2,5kg plastic jar.
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Solder Rods
Solder rods are ø 5mm X +/- 320mm (+/- 52g) pieces of LMPA-Q solder alloy in a 15kg box.
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Solder Bars
Interflux® Solder Bars are made from high purity, low oxidation metals in SnPb(Ag), lead-free and LMPA-Q alloys.
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Plain Solder Wires
Interflux® plain solder wire for automatic solder feeding on selective soldering systems in lead-free and SnPb(Ag) alloys and in the LMPA-Q alloy. Standard diameters are 2mm and 3mm on a 4kg role.