Products for dip soldering
Soldering fluxes for dip soldering
Interflux® IF 8300 is a no-clean, halide-free tacky gel flux suitable for reballing and BGA rework.
Interflux® IF 2005M is the internationally renowned resin- and rosin-free, no-clean / No-residue™ flux standard.
Interflux® IF 2005C with 3,3% of solids is a resin- and rosin-free, no-clean soldering flux. It can be used when the soldering process needs more activation than IF 2005M or IF 2005K provide.
IF 2005C is preferred for selective soldering but can be used for wave and dip soldering too.
OR L0 according to EN and IPC standards
Interflux® RA 38053 is an activated rosin based dipping flux that gives good adhesion to the surfaces to be soldered.
Interflux® Tarnex 10 is a highly activated alcohol based flux with water soluble residues for tinning of tarnished, heavily oxidized or hard to solder surfaces. The residues after soldering must be cleaned with water. Tarnex 10 has been specifically designed for dip soldering operations. Due to its activity level, Tarnex 10 is not recommended for soldering electronics.
Tarnex 10 is only available on request.
IF 3006K has been replaced by IF 3006.
IF 2005-2,5% has been replaced by IF 2005K.
Auxiliaries for dip soldering
Solder alloys for dip soldering
Plain Solder Wires
Interflux® plain solder wire for automatic solder feeding on selective soldering systems in lead-free and SnPb(Ag) alloys and in the LMPA-Q alloy. Standard diameters are 2mm and 3mm on a 4kg role.
Solder stones are convexly shaped pieces of LMPA-Q solder with dimensions of +/- d:37mm and H: 15mm for easy solder bath filling. The standard package is a 2,5kg plastic jar.
Solder rods are ø 5mm X +/- 320mm (+/- 52g) pieces of LMPA-Q solder alloy in a 15kg box.
Interflux® Solder Bars are made from high purity, low oxidation metals in SnPb(Ag), lead-free and LMPA-Q alloys.
Interflux® Solder Pellets are small pieces of solder for easy solder bath filling in lead-free and SnPb(Ag) alloys.