Products for pre-tinning
Solder alloys for pre-tinning
Plain Solder Wires
Interflux® plain solder wire for automatic solder feeding on selective soldering systems in lead-free and SnPb(Ag) alloys and in the LMPA-Q alloy. Standard diameters are 2mm and 3mm on a 4kg role.
Interflux® Solder Pellets are small pieces of solder for easy solder bath filling in lead-free and SnPb(Ag) alloys.
Solder stones are convexly shaped pieces of LMPA-Q solder with dimensions of +/- d:37mm and H: 15mm for easy solder bath filling. The standard package is a 2,5kg plastic jar.
Interflux® Solder Bars are made from high purity, low oxidation metals in SnPb(Ag), lead-free and LMPA-Q alloys.
Solder rods are ø 5mm X +/- 320mm (+/- 52g) pieces of LMPA-Q solder alloy in a 15kg box.
Soldering fluxes for pre-tinning
Interflux® PacIFic 2009M is a water based no-clean flux mainly used for wave soldering but also for selective soldering and tinning. PacIFic 2009M has a long history of use in virtually all electronic branches worldwide.
Interflux® IF 3006 is a resin- and rosin free, no-clean soldering flux with a reduced VOC content.
Interflux® IF FL5821 is a highly activated flux with water soluble residues that must be cleaned with water after soldering. IF FL5821 can be used for tinning of surfaces with very poor solderability. Due to its activity level, IF FL5821 is not recommended for soldering electronics.
IF FL5821 is only available on request.
Auxiliaries for pre-tinning
Interflux® Anti-oxidant pellets minimize the formation of oxides on lead-free and SnPb(Ag) solder baths. Used as an addition in the solder bath.
The product is not recommended to be used in closed nitrogen machines nor in combination with Ni-doped soldering alloys.
Interflux® IF 910 de-oxidation oil separates oxides from good solder in a solder bath. It can drastically reduce the solder consumption.