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Limited availability
Perfect for robot soldering
Low spattering
Fast wetting
Low soldering tip contamination
Low residue
Absolutely halogen free
Interflux® IR 3 is an absolutely halide-free, lead-free, no-clean solder wire that has been developed for robot soldering. It provides low spattering, fast wetting, low soldering tip contamination and low residue.
Interflux® IR 3 is an absolutely halide-free, lead-free, no-clean solder wire that has been developed for robot soldering. It provides low spattering, fast wetting, low soldering tip contamination and low residue.
IR 3 can also be used for hand soldering with the same advantages.
ROL0 to EN and IPC standards
Increased wetting speed
Transparent residue
Absolutely halide-free
Interflux® QF 70 is an absolutely halide-free, rosin based no-clean solder wire with fast wetting for fast soldering operations in lead-free alloys.
Interflux® QF 70 is an absolutely halide-free, rosin based no-clean solder wire with fast wetting for fast soldering operations in lead-free alloys.
QF 70 can be used in both hand soldering and auto-mated soldering processes
RO L0 to IPC and EN standards.
Halide content 0,00%
Increased wetting ability, increased wetting speed
Low spattering
Colophony free
Low transparent residue
High repeatability
Perfect for laser soldering
Interflux® NH 1 is a no-clean colophony free activated solder wire that gives fast and repeatable soldering results on a wide range of surfaces including brass, in lead-free alloys.
Interflux® NH 1 is a no-clean colophony free activated solder wire that gives fast and repeatable soldering results on a wide range of surfaces including brass, in lead-free alloys.
NH 1 can be used in both hand soldering and auto-mated soldering processes
RE L1 to IPC and EN standards.
Increased wetting ability
Non disturbing smell
High repeatability
Smooth transparent residue
Suitable for robot soldering
Interflux® RosIX 705 is an activated rosin based, no-clean solder wire with increased wetting ability on surfaces that are difficult to solder in lead-free alloys.
Interflux® RosIX 705 is an activated rosin based, no-clean solder wire with increased wetting ability on surfaces that are difficult to solder in lead-free alloys.
RosIX 705 can be used on surfaces that are difficult
to solder, e.g. OSP, Ni, Zn, brass, German silver, etc.. as well
as on degraded and oxidized surfaces.
RO L1 to IPC and EN standards.
Filo solubile in acqua
Filo di saldatura Lead-free
Per rilavorazione & riparazione
Assolutamente senza alogenuri
Alta attivazione
Interflux® Aquasol 4018 è un filo di saldatura altamente attivato con residui solubili in acqua nelle leghe lead-free.
Interflux® Aquasol 4018 è un filo di saldatura altamente attivato con residui solubili in acqua nelle leghe lead-free.
Ottima saldabilità su superfici difficili da saldare.
I residui devono essere puliti.
I residui possono essere puliti con acqua DI a 35°C-45°C (95°F— 114°F)
OR H1 secondo le norme EN e IPC standard
Flussante contenuto: 2.5%
Filo di saldatura Lead-free
Per rilavorazione & riparazione
Residui spazzolabili
Assolutamente senza alogenuri
Assolutamente senza colofonia
Basso residuo
Interflux® IF 14 serie sono fili di saldatura, no clean, senza colofonia e senza alogenuri, con un residuo facilmente rimovibile in leghe lead-free e SnPb(Ag).
Interflux® IF 14 serie sono fili di saldatura, no clean, senza colofonia e senza alogenuri, con un residuo facilmente rimovibile in leghe lead-free e SnPb(Ag).
Residui spazzolabili a mano
RE L0 secondo le norme EN e IPC standards
Lead-free : IF 14-16 e IF 14-22 (1,6% e 2,2% contenuto di fluss.)
SnPb(Ag) : 0,6%, 0,9%,1,0% and 1,4% of flux content
Filo di saldatura Lead-free
Per rilavorazione & riparazione
Contenente colofonia
Assolutamente senza alogenuri
Ridotto spattering
Interflux® Flexsol 903 è un filo di saldatura, no-clean, senza alogenuri, con ridotto spattering, nelle leghe lead-free.
Interflux® Flexsol 903 è un filo di saldatura, no-clean, senza alogenuri, con ridotto spattering, nelle leghe lead-free.
RO L0 secondo le norme EN e IPC standards.
Flusante contenuto: 2,2% and 3,5%
Increased wetting ability
Non disturbing smell
High repeatability
Smooth transparent residue
Perfect for laser soldering
Interflux® RosIX 705 is an activated rosin based, no-clean solder wire with increased wetting ability on surfaces that are difficult to solder in SnPb(Ag) alloys.
Interflux® RosIX 705 is an activated rosin based, no-clean solder wire with increased wetting ability on surfaces that are difficult to solder in SnPb(Ag) alloys.
RosIX 705 can be used on surfaces that are difficult to solder, e.g. OSP, Ni, Zn, brass, German silver,... as well as on degraded and oxidized surfaces.
RO L1 to IPC and EN standards.
Filo di saldatura SnPb(Ag)
Per rilavorazione & riparazione
Residui spazzolabili
Assolutamente senza alogenuri
Assolutamente senza colofonia
Basso residuo
Interflux® IF 14 serie sono fili di saldatura, no-clean, senza alogenuri e senza colofonia, il cui residuo è facilmente rimovibile, in leghe SnPb(Ag) e lead-free.
Interflux® IF 14 serie sono fili di saldatura, no-clean, senza alogenuri e senza colofonia, il cui residuo è facilmente rimovibile, in leghe SnPb(Ag) e lead-free.
Residui spazzolabili a mano
RE L0 secondo le norme EN e IPC standards
SnPb(Ag) : IF 14-06, IF 14-09, IF 14-10, IF14-14 (0,6%, 0,9%,1,0% e 1,4% di flussante contenuto)
Lead-free : 1,6% and 2,2% of flux content
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