Interflux® QF 70 is an absolutely halide-free, rosin based no-clean solder wire with fast wetting for fast soldering operations in lead-free alloys.
QF 70 can be used in both hand soldering and auto-mated soldering processes
RO L0 to IPC and EN standards.
Halide content 0,00%

Interflux® NH 1 is a no-clean colophony free activated solder wire that gives fast and repeatable soldering results on a wide range of surfaces including brass, in lead-free alloys.
NH 1 can be used in both hand soldering and auto-mated soldering processes
RE L1 to IPC and EN standards.

Interflux® RosIX 705 is an activated rosin based, no-clean solder wire with increased wetting ability on surfaces that are difficult to solder in lead-free alloys.
RosIX 705 can be used on surfaces that are difficult
to solder, e.g. OSP, Ni, Zn, brass, German silver, etc.. as well
as on degraded and oxidized surfaces.
RO L1 to IPC and EN standards.

Interflux® Aquasol 4018 is a high activity solder wire with water soluble residues in lead-free alloys.
Very good wetting ability on surfaces with poor solderabilty
Residues must be cleaned
Residues can be cleaned with DI water at 35°C-45°C (95°F— 114°F)
OR H1 to EN and IPC standards
Flux content: 2.5%

Interflux® IF 14 series nie zawiera kalafonii, 100% pozbawiony halogenków, nie wymagający czyszczenia druty lutownicze z łatwo usuwalnym osadem Stopy bezołowiowe i SnPb(Ag).
Osad usuwalny ręcznie
RE L0 według oznaczeń IPC i EN
Bezołowiowe : IF 14-16 i IF 14-22 (1,6% i 2,2% zawartości topnika)
SnPb(Ag) : 0,6%, 0,9%,1,0% i 1,4% zawartości topnika

Interflux® Flexsol 903 to 100% pozbawiony halogenków, nie wymagający czyszczenia drut lutowniczy z redukcja odprysków w mieszankach bezołowiowych.
RO L0 według oznaczeń IPC i EN.
zawartość topnika: 2,2% i 3,5