Solder pastes for low melting point soldering (LMPA)
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LMPA-Q6
Interflux® LMPA-Q6 is a no-clean solder paste with the high reliability LMPA-Q low melting point alloy. LMPA-Q6 facilitates the use of temperature sensitive components and reduces production costs.
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LMPA-Q7
Interflux LMPA-Q7 is a low melting point solder paste with optimised stencil performance and enhanced mechanical properties. LMPA-Q7 succeeds LMPA-Q6.
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DP 5600
Interflux® DP 5600 is a no-clean solder paste for low temperature SnBi(Ag) alloys.
RO L0 to EN and IPC standards
Sn42Bi57Ag1 (melting point 139°C ~ 282°F)