Solder wires for robot soldering

  1. NH 1 SnAgCu 500g

    NH 1

    Activated solder wire

    new

    Interflux® NH 1 is an activated no-clean colophony free and lead-free solder wire that gives fast and repeatable soldering results on a wide range of surfaces including brass. NH 1 provides fast wetting and low spattering making it particularly suitable for robot and laser soldering but also for normal hand soldering.
  2. Aquasol 4018 solder wire SnAgCu 500g

    Aquasol 4018

    Water soluble solder wire

    Interflux® Aquasol 4018 is a high activity solder wire with water soluble residues in SnPb and lead-free alloys. Very good wetting ability on surfaces with poor solderabilty. Residues must be cleaned.
    Residues can be cleaned with DI water at 35°C-45°C (95°F— 114°F).
     OR H1 to EN and IPC standards
     Flux content: 2,5%
  3. RosIX 705 SnAgCu 500g

    RosIX 705

    Activated solder wire

    new

    Interflux® RosIX 705 is an activated rosin based, no-clean solder wire with increased wetting ability in lead-free and SnPb(Ag) alloys. RosIX 705 can be used on surfaces that are difficult to solder like e.g. OSP, Ni, Zn, brass, German silver, ... as well as on degraded and oxidized surfaces.
  4. IR 3 SnAgCu 500g

    IR 3

    lead-free solder wire

    Interflux® IR 3 is an absolutely halide-free, lead-free, no-clean solder wire that has been developed for robot soldering. It provides low spattering, fast wetting, low soldering tip contamination and low residue. IR 3 can also be used for laser and hand soldering with the same advantages.