Soldering fluxes for wave soldering

  1. IF 2005C 1L

    IF 2005C

    Selective soldering flux

    Interflux® IF 2005C with 3,3% of solids is a resin- and rosin-free, no-clean soldering flux. It can be used when the soldering process needs more activation than IF 2005M or IF 2005K provide.
    IF 2005C is preferred for selective soldering but can be used for wave and dip soldering too.

    OR L0 according to EN and IPC standards
  2. IF 3006 10L angle

    IF 3006

    Reduced VOC soldering flux

    Interflux® IF 3006 is a resin- and rosin free, no-clean soldering flux with a reduced VOC content.
  3. PacIFic 2010F 10L angle

    PacIFic 2010F

    Foamable water based soldering flux

    Interflux® PacIFic 2010F is a water based no-clean soldering flux for foam fluxing applications. PacIFic 2010F provides low residues after soldering.
  4. IF 2005M 10L angle

    IF 2005M

    No-Residue™ soldering flux

    popular

    Interflux® IF 2005M is the internationally renowned resin- and rosin-free, no-clean / No-residue™ flux standard.
  5. AF 4818 PbF soldering flux 10L angle

    AF 4818-PbF

    Rosin based soldering flux

    Interflux® AF 4818 PbF is a solvent based, rosin containing, no-clean soldering flux with increased solid content and a large process window.
    It provides increased chances to pass harsh environmental tests as sometimes required in the automotive industry.
  6. IF 2005K 10L angle

    IF 2005K

    Low residue soldering flux

    Interflux® IF 2005K with 2,5% of solids is a resin- and rosin-free, no-clean soldering flux. It can be used when the soldering process needs more activation than IF 2005M provides.
    IF 2005K is preferred for lead-free wave soldering but is also suitable for selective soldering and SnPb wave soldering.
  7. Pacific 2009M 10L angle

    PacIFic 2009M

    All-round water based soldering flux

    popular

    Interflux® PacIFic 2009M is a water based no-clean flux mainly used for wave soldering but also for selective soldering and tinning. PacIFic 2009M has a long history of use in virtually all electronic branches worldwide.
  8. PacIFic 2009MLF E 10L angle

    PacIFic 2009MLF-E

    Reduced solder ball soldering flux

    PacIFic 2009MLF-E is a water based no-clean flux which combines low residue levels after soldering with reduced micro solder ball formation.
  9. PacIFic 2009MLF 10L angle

    PacIFic 2009MLF

    'Anti -solder ball' soldering flux

    PacIFic 2009MLF is a water based no-clean soldering flux developed to minimize micro solder ball formation.
  10. OSPI 3311M 10L angle

    OSPI 3311M

    Flux for soldering OSP

    new

    Interflux® OSPI 3311M is an alcohol based no-clean flux for soldering OSP finished boards that have passed one or more reflow cycles. OSPI 3311M provides optimised through hole fill on degraded OSP finishes.